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Thin ultra-small chip LEDs PICOLED™ SML-P1 Series (15-Color Lineup)

Ultra-compact low-profile chip LEDs: PICOLED™

Product Overview

SML-P1 series

ROHM is expanding its industry-leading PICOLED™ lineup of thin, ultra-compact LEDs optimized for portable devices such as smartphones and wearable tech. 7 new colors have been added to the series, increasing the number of models from 8 to 15, providing greater applicability.

Feature 1:Expanded 15-color lineup

Part No. Absolute Maximum Ratings Electrical Characteristics
Forward
Current
IF(mA)
Operating
Temp
Topr
(℃)
Forward Voltage
VF
Emission Wavelength ID Luminosity Iv ※2
Typ.
(V)
IF
(mA)
※1
Min.
(nm)
Typ.
(nm)
※1
Max.
(nm)
IF(mA) Min.
(mcd)
※1
Typ.
(mcd)
IF(mA)
SML-P12VT(R) 20 -40~
+85
2.0 20 625 630 635 20 25 60 20
SML-P12UT(R) 615 620 625 40 85
NEW
SML-P12U2T(R)
2.1 610 615 620 25 70
SML-P12DT(R) 602 605 608 63 100
NEW
SML-P12Y3T(R)
593 596 599 40 90
SML-P12YT(R) 587 590 593 40 100
NEW
SML-P12WT(R)
582 585 588 25 70
NEW
SML-P12Y2T(R)
577 580 583 16 50
NEW
SML-P12M2T(R)
2.2 573 576 579 10 25
SML-P12MT(R) 569 572 575 10 25
NEW
SML-P13FT(R)
2.1 563 566 569 6.3 18
NEW
SML-P13PT(R)
557 560 563 4.0 10
SMLP13EC8T(R) 10 3.0 5 520 527 535 5 56 110 5
SMLP13BC8T(R) 2.9 465 470 475 9.0 25
SCMP13WBC8W (x,y)(0.30 , 0.30) 90 150

※1:Reference value  ※2:10% measurement tolerance

Feature 2: Industry-leading 0.2mm thickness achieved using original production technology

Reduced chip size and thickness

1.Proprietary device technology

  • - Chip size minimized while maintaining brightness
  • - Successfully implemented further epitaxial growth in low-profile wafers
The industry's thinnest package

2.Class-leading small package size

  • - Package miniaturization technology made it possible to fit both die and wire bonding into a 0.6×0.6mm area. Square emission characteristics ideal for dot matrix displays.
Extemal Dimensions

Feature 3:High reliability package prevents solder intrusion

Solder intrusion countermeasures are implemented, taking into consideration conditions during reflow,
to achieve superior reliabilty in a compact form factor.

Increased reliability

Solder Resist is added before the plating process and solder penetration into the resin is prevented by blocking the wettable gold pattern

Applications

Smart watches、Smartphones、Tablets
  • Smartphones
  • Tablets (personal computing)
  • Smart glass (display-equipped eyeglasses)
  • Smart watches
  • Health & fitness devices
  • Various indicators and meters
  • Drones

Supports high-density mounting in NUI-equipped (Natural User Interface) wearable devices

Smart Watches
Smartphones
Tablet PCs

Related Information

■ New Product Bulletin
Thin Ultra-Compact PICOLEDTM Chip LEDs
Thin Ultra-Compact PICOLED™ Chip LEDs   (342KB)

ROHM leverages the latest proprietary technologies to develop products and solutions optimized to user and market needs.

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