ROHM Offers the Smallest* Electronic Components in the Industry This new ultra-compact family is ideal for high density, high-performance mobile products and wearable devices

New RASMID™ lineup developed using innovative, breakthrough technologies Click here for details on RASMID™

Proprietary methods ensure unprecedented compactness with superior dimensional accuracy

World's Smallest* Chip Resistors: 03015 Size

Chip area reduced 44%

Key
Features

  • World's smallest size - mounting area reduced by 44%
  • Original processes utilized for high accuracy
  • Chip dimensional precision improved from ±20um to ±10um
  • Gold electrodes adopted for improved solderability and reliability
Product Family Package (mm)
SMR003 Series CSP (Chip Scale Package): 0.3x0.15, t=0.1

FAQ

CSP (Chip Scale Package)

World's Smallest* Diodes: 0402 Size (01005 in)

Chip area reduced 56%

Key
Features

  • World's smallest size - mounting area reduced by 56%
  • Chip dimensional precision improved from ±20um to ±10um, improving stability in existing automated mounting equipment
  • Gold electrodes utilized for superior solderability and reliability
Product Family Package (mm)
SMD0402 (0402): 0.4x0.2, t=0.12

FAQ

CSP (Chip Scale Package)

RASMID™ is a trademark of ROHM Co., Ltd. Please note that the percentages for area and volume were rounded off to the nearest integer.

The world's smallest micro devices

World's Smallest* Monolithic Power Supplies (IC Modules): IC integrated within the substrate for greater miniaturization

Key
Features

  • Buck Types
    650mA, 1.2V/1.25V/1.8V/1.85V, 6MHz
  • Boost Types
    175mA/19mA, 5V/4.5V, 238kHz/642kHz
Product Family Package (mm)

BGA-MD (8pin): 2.3x2.9, t=1.0 max.
BGA-MDP (8pin): 2.3x2.9, t=1.05 max.
BGA-MD (8pin): 2.9x2.9, t=1.0 max.
BGA-MDP (8pin): 2.3x2.9, t=1.05 max.
BGA-MDP (8pin): 2.3x2.9, t=1.05 max.
BGA-MD (9pin): 2.3x2.4, t=1.0 max.

Ultra-Compact Module

World's Smallest* CMOS LDOs: TF2 Series

Chip area reduced 34%

Key
Features

  • 5.5V input, 200mA, high PSRR CMOS LDO
Product Family Package (mm)
TF2 Series

XCSP30L1: 0.65x0.65, t=0.35 max.

XCSP30L1 (Pin pitch: 0.35mm))

World's Smallest* Transistors: 0604 Size

Chip area reduced 83%

Key
Features

  • Pch, Nch, Pd=100mW
Product Family Package (mm)

VML0604 (0604): 0.6x0.4, t=0.36

VML0604

Class-leading* size Transistors: 0806 Size

Chip area reduced 67%

Key
Features

  • Pch, Nch, Pd=100mW
Product Family Package (mm)

VML0806 (0806): 0.8x0.6, t=0.36

VML0806

Class-leading* size Ultra-Compact Low Profile Chip LEDs: 1006-Size PICOLED™ Series

Chip area reduced 53%

Key
Features

  • The smallest class of monochrome (single-color) chip LEDs
  • Special package design prevents solder penetration
  • Ideal for matrix displays in wearable devices
  • PICOLED™-eco series available (1mA class)
Product Family Package (mm)

PICOLED™: 1.0x0.6, t=0.2

PICOLED™ -eco: 1.0x0.6, t=0.2

PICOLED™ (SML-P1)

World's Smallest* Ultra-Low Ohmic Chip Resistors for Current Detection: 0603 Size (0201 in)

Chip area reduced 64%

Key
Features

  • Special alloy used for the resistive element, resulting in superior TCR characteristics
  • Trimless design improves current detection accuracy
  • Proprietary chip structure ensures high reliability even under harsh temperature changing environments
Product Family Package (mm)

PMR006: 0.6x0.3, t=0.23

PMR006

World's Smallest* Tantalum Capacitors: 1005 Size (0402 in)

Chip area reduced 63%

Key
Features

  • 0.47µF to 15µF, 20V to 2.5V
Product Family Package (mm)

TCT U Case: 1.0x0.5, t=0.6 max.

TCT (U Case)

World's Smallest* Conductive Polymer Capacitors: 1005 Size (0402 in)

Chip area reduced 63%

Key
Features

  • 0.47µF to 4.7µF, 10V to 2.5V
Product Family Package (mm)
Conductive Polymer Bottom Electrode Type (Large Capacitance): TCTO Series

TCTO U Case: 1.0x0.5, t=0.6 max.

TCTO (U Case)

PICOLED™ is a registered trademark of ROHM Co., Ltd. Please note that the percentages for area and volume were rounded off to the nearest integer.

Mounting Equipment

Implementation has been verified. Please contact the maker of the mounter in question.

ApplicationsApplication List

Smart watches/ Smartphones/ Tablet PCs

Supports high density mounting in wearable devices
with NUI (Natural User Interface) for intuitive operation

  • Smartphones (multifunction mobile phones)
  • Tablet PCs
  • Smart glasses using augmented reality
  • Smart watches (that log activity data)
  • Biometric authentication devices
  • Head-mounted displays
  • Health & fitness devices
  • Next-generation gaming systems