Automotive Microwire BUS 4Kbit (256x16bit) EEPROM - BR93H66RFJ-2C

BR93H66-2C is a serial EEPROM of serial 3-line interface method.

Part Number
Unit Quantity
Minimum Package Quantity
Packing Type
BR93H66RFJ-2CE2 Active SOP-J8 2500 2500 Taping Yes
Grade Automotive
I/F MicroWire BUS(3-Wire)
Density [bit] 4K
Bit Format [Word x Bit] 256 x 16
Package SOP-J8
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 125
Vcc(Min.)[V] 2.5
Vcc(Max.)[V] 5.5
Circuit Current (Max.)[mA] 3.0
Standby Current (Max.)[μA] 10.0
Write Cycle (Max.)[ms] 4.0
Input Frequency (Max.)[Hz] 2M
Endurance (Max.)[Cycle] 106
Data Retention (Max.)[Year] 100
  • ・ Conforming to Microwire BUS
    ・ Withstands electrostatic voltage 6kV (HBM method typ.)
    ・ Wide temperature range -40℃ to +125℃
    ・ Same package line up and same pin configuration
    ・ 2.5V to 5.5V single supply voltage operation
    ・ Address auto increment function at read operation
    ・ Write mistake prevention function Write prohibition at power on Write prohibition by command code Write mistake prevention circuit at low voltage
    ・ Program cycle auto erase and auto end function
    ・ Program condition display by READY / BUSY
    ・ Low current consumption At write operation (at 5V) : 0.8mA (Typ.) At read operation (at 5V) : 0.5mA (Typ.) At standby operation (at 5V) : 0.1μA (Typ.) (CMOS input)
    ・ Compact package MSOP8 / TSSOP-B8 / SOP8 / SOP-J8
    ・ High reliability by ROHM original Double-Cell structure
    ・ Data retention for 20 years(Ta≦125℃)
    ・ Endurance up to 300,000 cycles(Ta≦125℃)
    ・ Data at shipment all address FFFFh
Other New/Updated Products Relating to Memory
PART NUMBER Product Name Package Datasheet Distribution Inventory
BR93H66RF-2C Automotive Microwire BUS 4Kbit (256x16bit) EEPROM SOP8   Buy Sample
BR93H66RFVT-2C Automotive Microwire BUS 4Kbit (256x16bit) EEPROM TSSOP-B8   Buy Sample
BR93H66RFVM-2C Automotive Microwire BUS 4Kbit (256x16bit) EEPROM MSOP8   Buy Sample
New Products:
Technical Data
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.