Automotive SPI BUS 2Kbit(256x8bit) EEPROM - BR25H020FJ-2C

BR25H020-2C is a serial EEPROM of SPI BUS interface method.

Part Number
Unit Quantity
Minimum Package Quantity
Packing Type
BR25H020FJ-2CE2 Active SOP-J8 2500 2500 Taping Yes
Grade Automotive
Density [bit] 2K
Bit Format [Word x Bit] 256 x 8
Package SOP-J8
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 125
Vcc(Min.)[V] 2.5
Vcc(Max.)[V] 5.5
Circuit Current (Max.)[mA] 4.0
Standby Current (Max.)[μA] 10.0
Write Cycle (Max.)[ms] 4.0
Input Frequency (Max.)[Hz] 10M
Endurance (Max.)[Cycle] 106
Data Retention (Max.)[Year] 40
  • ・ High speed clock action up to 10MHz (Max.)
    ・ Wait function by HOLDB terminal.
    ・ Part or whole of memory arrays settable as read only memory area by program.
    ・ 2.5V to 5.5V single power source action most suitable for battery use.
    ・ Page write mode useful for initial value write at factory shipment.
    ・ For SPI bus interface (CPOL, CPHA)=(0, 0), (1, 1)
    ・ Self-timed programming cycle.
    ・ Low Supply Current At write operation (5V) : 1.0mA (Typ.) At read operation (5V) : 1.0mA (Typ.) At standby operation (5V) : 0.1μA (Typ.)
    ・ Address auto increment function at read operation
    ・ Prevention of write mistake Write prohibition at power on. Write prohibition by command code (WRDI). Write prohibition by WPB pin. Write prohibition block setting by status registers (BP1, BP0). Prevention of write mistake at low voltage.
    ・ MSOP8, TSSOP-B8, SOP8, SOP-J8 Package
    ・ Data at shipment Memory array: FFh, status register BP1, BP0 : 0
    ・ More than 100 years data retention.
    ・ More than 1 million write cycles.
    ・ AEC-Q100 Qualified.
Other New/Updated Products Relating to Memory
PART NUMBER Product Name Package Datasheet Distribution Inventory
BR25H020F-2C Automotive SPI BUS 2Kbit(256x8bit) EEPROM SOP8   Buy Sample
BR25H020FVM-2C Automotive SPI BUS 2Kbit(256x8bit) EEPROM MSOP8   Buy Sample
BR25H020FVT-2C Automotive SPI BUS 2Kbit(256x8bit) EEPROM TSSOP-B8   Buy Sample
New Products:
Technical Data
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.