Quasi-Resonant Control type DC/DC Converter IC - BM1Q011FJ (Under Development)

The quasi-resonant controller typed AC/DC converter IC BM1Q011FJ provides an optimum system for all products that include an electrical outlet. Quasi-resonant operation enables soft switching and helps to keep EMI low. With MOSFET for switching and current detection resistors as external devices, a higher degree of design freedom is achieved. This IC built in HV starter circuit, it contributes to low consumption power and high speed start. Because the burst mode is built-in and IC consumption current is low, stand-by power becomes very low. Because BM1Q011FJ series built-in soft-start, burst mode, over current limiter which is cycle-by-cycle, over load protection, over voltage protection, CS Open Protection and so on, BM1Q011FJ are highly safety.

* This product is a STANDARD grade product and not recommend for on-vehicle devices.
Part Number
Unit Quantity
Minimum Package Quantity
Packing Type
BM1Q011FJ-E2 Under Development SOP-J7S 2500 2500 Taping Yes
Controller Type QR
Vin1(Min.)[V] 8.9
Vin1(Max.)[V] 26.0
Start Circuit [V] 600.0
SW frequency(Max.)[KHz] 120.0
Vcc OVP Auto Restart
Channel 1
Light Load mode Yes
Soft Start Yes
Under Voltage Lock Out Yes
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 85
    • Quasi-resonant method
    • Built-in 650V tolerate start circuit
    • Low power at the light load (burst operation)
    • Maximum frequency control (120kHz)
    • Frequency reduction function
    • AC voltage correction function
    • VCC pin : under voltage protection
    • VCC pin : over voltage protection
    • Over-current protection (cycle-by-cycle)
    • Output driver 12V clamp circuits
    • Soft start function
    • ZT trigger mask function
    • Over Load protection [Auto-restart]
    • CS pin open protection [Auto-restart]
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New Products:
ROHM Semiconductor reserves the right to change the specifications at any time.
Technical Data
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.