SML-D22MUW
Small 2-color light-emitting type, Molded chip LED (Yellow-green/Red)
SML-D22MUW
Small 2-color light-emitting type, Molded chip LED (Yellow-green/Red)
SML-D2 series is an industry standard 1608 Size, small two-color, surface-mount chip LED.
Product Detail
Specifications:
Package Type
Dual Color / Mini-mold
LED Type
Standard
Application
Home Appliance, Industrial Equipment, Helthcare, Amusement, Office Equipment, PC, Data Storage
Package size[mm]
1.6x0.8 (t=0.55)
Emitting color
Yellowish-Green / Red
Dominant wave-length λD(Multi)(Typ.)[nm]
570 / 620
Luminous Intensity(Multi)(Typ.)[mcd]
10 / 16
Number of Brightness Rank
4
Forward Voltage VF (Typ.) [V]
2
IF @ VF [mA]
5
Chip Structure
AlGaInP
Power Dissipation [mW]
67 / 65
Operating Temperature[°C]
-40 to 105
Storage Temperature [°C]
-40 to 110
Features:
Supporting Information
Broad chip LED lineup.
ROHM's SML-D2 series integrates 2 colors in a compact 1608 package - the same size as conventional single-color chip LEDs.
Key Features
Class-leading compact size contributes to smaller, thinner devices
In addition to element miniaturization, the SML-D2 series leverages PICOLED ® *1）mounting and wire bonding*2）technologies to mount 2 chips (red and green) in a compact 1.6 x 0.8mm package – the same size as conventional single-color LEDs.
Also, the extremely close configuration of color elements results in excellent color mixing properties that make it possible to produce not only red and green colors, but a number of intermediate colors as well.
Solder penetration countermeasure ensures superior reliability
Incorporating a stopper called a ‘resist' before the gold plating process blocks the gold pattern (that features good wettability).
This prevents solder penetration into the resin, eliminating failures due to short-circuits and contributing to greater reliability.
Backside electrode configuration supports high-resolution display
Adopting a backside electrode design allows mounting in narrow spaces, enabling high-definition display in dot matrix and other applications.
Lineup
| Part No. | Forward Current IF(mA) |
Forward Voltage VF(V) |
Emission Wavelength λD(nm) |
Light Intensity IV(mcd) |
|---|---|---|---|---|
| NEW SML-D22MUW |  5 |
2.0 | 570 | 10 |
 5 |
1.9 | 620 | 16 | |
| ☆ SML-D22YVW |  5 |
2.0 | 588 | 25 |
 5 |
1.85 | 629 | 16 |
☆：Under development
※Different color combinations can be considered
※The products are under development and therefore the specifications may change without notice
Applications
- Consumer Electronics
- Home Appliances
- FA
＜Terminology＞
- *1) PICOLED®
ROHM's ultra-compact LEDs ideal for portable equipment such as wearables and mobile devices. - *2) Wire Bonding
The process of mounting a chip directly on a substrate and connecting gold, aluminum, or copper wires.
