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WL-CSP EEPROM - BR25S128GUZ-WNew package type, which is WL-CSP, is lined up to the high-reliability EEPROMs. There are a variety of interface products available such as I²C BUS and SPI BUS for the small application (i.e. wireless LAN, Blue tooth, and so on).
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* This product is a STANDARD grade product and not recommend for on-vehicle devices. |
Specifications:
Grade | Standard |
I/F | SPI BUS |
Density [bit] | 128K |
Bit Format [Word x Bit] | 16K x 8 |
Package | VCSP35L2 |
Operating Temperature (Min.)[°C] | -40 |
Operating Temperature (Max.)[°C] | 85 |
Vcc(Min.)[V] | 1.7 |
Vcc(Max.)[V] | 5.5 |
Circuit Current (Max.)[mA] | 2.5 |
Standby Current (Max.)[μA] | 2.0 |
Write Cycle (Max.)[ms] | 5.0 |
Input Frequency (Max.)[Hz] | 10M |
Endurance (Max.)[Cycle] | 106 |
Data Retention (Max.)[Year] | 40 |
Features:
- ・EEPROMs in the WL-CSP optimized for compact modules and portable devices
VCSP35L2 : 2.00 × 2.63 × 0.40 mm
・Completely conforming to the world standard SPI BUS
・Wide operating voltage range:1.7 to 5.5V
・Data rewrite up to 1,000,000times
Applications:
Pin Configuration:
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New Products:
Technical Data
Thermal Resistance
The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
Part Explanation
For ICs