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WL-CSP EEPROM - BR25S128GUZ-W

New package type, which is WL-CSP, is lined up to the high-reliability EEPROMs. There are a variety of interface products available such as I²C BUS and SPI BUS for the small application (i.e. wireless LAN, Blue tooth, and so on).

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* This product is a STANDARD grade product and not recommend for on-vehicle devices.
Part Number
Status
Package
Unit Quantity
Minimum Package Quantity
Packing Type
RoHS
BR25S128GUZ-WE2 Active VCSP35L2 3000 3000 Taping Yes
 
Specifications:
Grade Standard
I/F SPI BUS
Density [bit] 128K
Bit Format [Word x Bit] 16K x 8
Package VCSP35L2
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 85
Vcc(Min.)[V] 1.7
Vcc(Max.)[V] 5.5
Circuit Current (Max.)[mA] 2.5
Standby Current (Max.)[μA] 2.0
Write Cycle (Max.)[ms] 5.0
Input Frequency (Max.)[Hz] 10M
Endurance (Max.)[Cycle] 106
Data Retention (Max.)[Year] 40
more
Features:
  • ・EEPROMs in the WL-CSP optimized for compact modules and portable devices
        VCSP35L2 : 2.00 × 2.63 × 0.40 mm
    ・Completely conforming to the world standard SPI BUS
    ・Wide operating voltage range:1.7 to 5.5V
    ・Data rewrite up to 1,000,000times
more
 
 
Pin Configuration:
Pin Configration
 
 
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New Products:
New Product List 
 
 
Technical Data
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.

Part Explanation

For ICs