Quasi-Resonant Control DC/DC converter and Power Factor Correction converter IC for AC/DC Converter - BM1050AF

BM1050AF is compounded LSI of Power Factor Correction converter (PFC) for harmonic solution and DC/DC converter (DC/DC). Because DC/DC operates on Quasi-resonant method, DC/DC contributes to Low EMI. BM1050AF built in a HV starter circuit that tolerates 650V. Because of putting the current sense resistors externally both the PFC part and the DC/DC part, IC enables power supply design free.
In the PFC part, IC adopts peak current control operation. Suitable application is proposed by a various protection circuit, such as the multiplier with a revision circuit on the AC voltage falls, the load regulation revision circuit, and the maximum power feed-forward circuit, etc. Moreover, the frequency hopping function is built in and it contributes to low EMI.

* This product is a STANDARD grade product and not recommend for on-vehicle devices.
Part Number
Unit Quantity
Minimum Package Quantity
Packing Type
BM1050AF-GE2 Active SOP24 2000 2000 Taping Yes
Controller Type PFC + QR
Vin1(Min.)[V] 8.5
Vin1(Max.)[V] 24.0
Start Circuit [V] 650.0
SW frequency(Max.)[KHz] 120.0
Vcc OVP Auto Restart / Latch
Channel 1
Light Load mode Yes
Under Voltage Lock Out Yes
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 85
  • · Quasi-resonant circuit + PFC circuit
    · Built-in HV Starter circuit
    · Low consumption current (typ.10uA) when starter circuit is OFF.
    · Quasi resonant circuit
    · Power Factor Correction circuit
    · Selectable protection method by LATCH/AUTOR
    · External stop function (COMP pin)
    · AC input voltage stop detected function (ACDET)
    · Built-in PFC stop terminal (PFCON/OFF)
Other New/Updated Products Relating to Power Management
PART NUMBER Product Name Package Datasheet Distribution Inventory
BM1051F Quasi-Resonant Control DC/DC converter and Power Factor Correction converter IC for AC/DC Converter SOP24   Buy Sample
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Technical Data
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.