Power Management IC for DSC/DVCs - BD9639MWV

BU9639MWV is 6ch system switching regulator IC that has built-in FET and Error amp phase compensation for CMOS sensor embedded model of DSC / DVC. The built-in circuit which consist of 2ch Buck-Boost / 2ch Buck / 2ch Boost circuits realize the high efficiency.

* This product is a STANDARD grade product and not recommend for on-vehicle devices.
Part Number
Unit Quantity
Minimum Package Quantity
Packing Type
BD9639MWV-E2 Active UQFN056V7070 1500 1500 Taping Yes
ch 6
Vin1(Min.)[V] 2.5
Vin1(Max.)[V] 5.5
SW frequency(Max.)[MHz] 2.0
Circuit Current(Typ.)[mA] 0.072
Reference Voltage1[V] 0.4
Operating Temperature (Min.)[°C] -20
Operating Temperature (Max.)[°C] 85
  • ・6ch DC/DC converter
        CH1  Boost FET embedded Start-up ch,Motor
        CH2  Buck FET embedded Core
        CH3  Buck-Boost FET embedded CMOS
        CH4  Buck-Boost FET embedded Digital
        CH5  Buck FET embedded CMOS, Memory
        CH6  Boost FET embedded LED
    ・Low voltage operation 2.5[V]
    ・CH1 supply voltage output for internal circuit
    ・CH1 PWM/PFM selectable
    ・CH3,CH4 Boost-Buck auto switching
    ・CH6 integrated Boost output shutdown (CH6 Load switch embedded)
    ・Soft-start correspondence to each channel
    ・Ground short protection(CH2~CH6)
    ・Error amp phase compensation(CH1~CH6)
    ・Operating frequency 1.5[MHz] (CH1~CH6)
    ・Package of mounting on high heat radiation side (UQFN056V7070)
Other New/Updated Products Relating to Power Management
PART NUMBER Product Name Package Datasheet Distribution Inventory
BD9634GU Switching Regulator ICs with Built-in FET (5V) VCSP85H4   inquiry
BD9866GUL 4CH Internal Power MOSFET System Switching Regulator VCSP50L3   Buy Sample
BD8355MWV Power Management IC for DSC/DVCs UQFN056V7070   Buy Sample
BD9355MWV Power Management IC for DSC/DVCs UQFN036V5050   Buy Sample
BD9757MWV Power Management IC for DSC/DVCs UQFN044V6060   Buy Sample
BD9865MWV Power Management IC for DSC/DVCs UQFN040V5050 - Buy Sample
New Products:
Technical Data
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.