In the low Zener current region the Zener voltage will become unstable due to the effects of noise during Zener breakdown. This will result in variations in the internal impedance, leading to Zener voltage fluctuations. Therefore, we recommend a Zener current Iz greater than 1mA in order to ensure stable operation.
Although the materials and internal structure differ, the specifications (i.e. external dimensions, electrical characteristics) remain the same. In contrast to the UDZS series, which features Sn-3Ag-0.5Cu plating, utilizes halogen resin and a wireless bonding method, the newer UDZV series employs 100% Sn plating, utilizes halogen-free resin, and wire bonding processes.
Although the materials differ, the specifications (i.e. external dimensions, electrical characteristics) remain the same. In contrast to the EDZS series, which features Sn-3Ag-0.5Cu plating and utilizes halogen resin, the newer EDZV series employs 100% Sn plating and utilizes halogen-free resin.
There is no specified operating temperature range for transistors and diodes. Stable operation is possible as long as the junction temperature Tj does not exceed the maximum rating. However, derating is highly advisable at higher temperatures. The recommended temperature range is -40°C to 100°C with a storage temperature range Tstg of -55C to 150°C.
The time to failure (product lifetime) will vary greatly depending on implementation, usage and environmental conditions. And although the failure rate can be estimated through accelerated lifetime testing, there are no specifications for product lifetime.
Depending on the storage environment, there should be no performance degradation caused by moisture absorbed by the packaging materials (MSL=1). However, solderability during mounting may be adversely affected due to terminal oxidation from long-term storage. In this case, we recommend that sufficient connection be ensured between the terminals and substrate, such as by lengthening the solder time. The recommended storage conditions are: 5-40°C, 30-80%RH, and 5 years for electroplated products. But solderability may be affected after 1 year for molten solder.