Short for Moisture Sensitivity Level, MSL is a JEDEC (Joint Electron Device Engineering Council) standard established for the purpose of preventing device failure due to volumetric expansion of atmospheric moisture introduced into the resin package of semiconductor devices during reflow. The floor life of IC packages, during which the components must be mounted and reflowed after opening the moisture-resistant packaging, is broken down into 8 MSL levels.
Absolute maximum ratings are parameter limits that should never, under any circumstances, be exceeded. Doing so may result in component failure or, at the very least, deterioration, which will shorten life, leading to breakdown.
We must refer to the Pd-Ta derating curve for the particular model. Looking at the derating curve for the UDZS series below, at 25ºC the power dissipation is approximately 200mW, while at 87.5ºC this decreases to 100mW. The type of board must be taken into consideration as well.
This refers to the thermal resistance based on heat generated at the PN (or Schottky) junction. Specifically, Rth(j-a) is the thermal resistance from the junction to ambient and Rth(j-c) signifies the resistance from the junction to the terminal. The graph below is useful to determining Tj (junction temperature) during operation. Please note that Rth may vary depending on the size of the land pattern and board materials.
Yes, manual soldering can be performed for all diodes. However, please note that the soldering temperatures will vary depending on the package type. Please refer to the data sheets for more information.
(1)Do not store diodes under conditions that may affect solderability: •Exposure to briny/sea air or corrosive gases (i.e. Cl2, H2S, NHs3, NO2) •In areas out of the recommended temperature/humidity range (2)Solderability is guaranteed for a period of 1 year from the date of shipment from ROHM, provided that the products are stored under our recommended conditions: 5-40ºC, 30-80%RH.