10bit 8ch D/A converter - BU2506FV

BU2506FV and BU2505FV are LSI's that respectively have 8ch and 10ch of 10bit R-2R type DAC.By cascade connection terminal, it is for applications requiring multi channels.Each channel has a full swing output type buffer amplifier with high speed output response characteristic, and can greatly shorten stability wait time.Digital input is for TTL level input, and the frequency of data transfer clock is for up to 10MHz.They have terminal that can set the upper limit value / the lower limit value of DAC output independently, and can easily set voltage range best fit for application.

* This product is a STANDARD grade product and not recommend for on-vehicle devices.
Part number
Unit Quantity
Minimum Package Quantity
Packing Type
BU2506FV-E2 Active SSOP-B20 2500 2500 Taping Yes
Resolution[bit] 10
Number of Channels 8
Update Rate[MHz] 10
Setring Time[µs] 20
Supply Voltage(Min.)[V] 4.5
Supply Voltage(Max.)[V] 5.5
Operating Temperature (Min.)[°C] -30
Operating Temperature (Max.)[°C] 85
  • ・Multi channels of R-2R type high performance 10bit D / A converter built in.
    (BU2506FV : 8 channels, BU2505FV : 10 channels)
    ・Full swing output type buffer amplifier built in each channel output.
    ・Output of all channels can be fixed to lower standard voltage by Reset terminal.
    ・Digital input corresponds to TTL level input.
    ・Data input by 14bit 3-line serial data + reset signal. (address 4bit + data 10bit)
    ・Cascade connection available.
    ・Data 10bit, by Reserve terminal, LSB / MSB switchable.
    ・Compact package of 0.65mm pitch 20 pins. (SSOP-B20)
Other New/Updated Products Relating to Data Converter
PART NUMBER Product Name Package Datasheet Distribution Inventory
BU22210MUV 10 channel in QFN Small Package 10 bit D/A Converters VQFN016V3030   inquiry
BU2508FV 10bit 4ch D/A converter SSOP-B14   Buy Sample
BU2507FV 10bit 6ch D/A converter SSOP-B14   Buy Sample
BU2505FV 10bit 10ch D/A converter SSOP-B20   Buy Sample
New Products:
Technical Data
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.