125°C Operation SPI BUS 1Kbit (128x8bit) EEPROM - BR25H010F-2LB(H2)

This is the product guarantees long time support in Industrial market. BR25H010-2C is a serial EEPROM of SPI BUS interface method.

Part number
Unit Quantity
Minimum Package Quantity
Packing Type
BR25H010F-2LBH2 Active SOP8 250 250 Taping Yes
Grade Industrial
Density [bit] 1K
Bit Format [Word x Bit] 128 x 8
Package SOP8
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 125
Vcc(Min.)[V] 2.5
Vcc(Max.)[V] 5.5
Circuit Current (Max.)[mA] 3.0
Standby Current (Max.)[μA] 10.0
Write Cycle (Max.)[ms] 4.0
Input Frequency (Max.)[Hz] 10M
Endurance (Max.)[Cycle] 106
Data Retention (Max.)[Year] 40
  • · Long time support a product for Industrial applications.
    · High speed clock action up to 10MHz (Max.)
    · Wait function by HOLDB terminal.
    · Part or whole of memory arrays settable as read only
    memory area by program.
    · 2.5V to 5.5V single power source action most
    for battery use.
    · Page write mode useful for initial value write at
    factory shipment.
    · For SPI bus interface (CPOL, CPHA)=(0, 0), (1, 1)
    · Self-timed programming cycle.
    · Low Supply Current
    At write operation (5V) : 1.0mA (Typ.)
    At read operation (5V) : 1.0mA (Typ.)
    At standby operation (5V) : 0.1µA (Typ.)
    · Address auto increment function at read operation
    · Prevention of write mistake
    Write prohibition at power on.
    Write prohibition by command code (WRDI).
    Write prohibition by WPB pin.
    Write prohibition block setting by status registers
    (BP1, BP0).
    Prevention of write mistake at low voltage.
    · Data at shipment Memory array: FFh, status register
    BP1, BP0 : 0
    · More than 100 years data retention.
    · More than 1 million write cycles.
Other New/Updated Products Relating to Memory
PART NUMBER Product Name Package Datasheet Distribution Inventory
New Products:
Technical Data
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.