Analog Input / BTL Output Class-D Speaker Amplifier - BD5413EFV

BD5413EFV is a 5W + 5W stereo class-D power amplifier specifically developed for low power consumption and low heatgeneration applications like powered speakers. BD5413EFV employs the state-of-the-art BCD (Bipolar, CMOS and DMOS)process technology to eliminate a turn-on resistance in the output power stage and an internal loss due to a wiringresistance as much as possible, achieving a high performance of 80% (4W + 4W output with a load resistance of 8O). Inaddition, BD5413EFV employs a compact power package which dissipates heat via the rear to achieve low powerconsumption and low heat generation so that the need for connecting an external heat radiator can be eliminated up to atotal output of 12.8W. This product meets the needs for compact, thin sound generation systems and powerful, high-qualitysound reproduction.

* This product is a STANDARD grade product and not recommend for on-vehicle devices.
Part number
Unit Quantity
Minimum Package Quantity
Packing Type
BD5413EFV-E2 Active HTSSOP-B24 2000 2000 Taping Yes
Vcc(Min.)[V] 6.0
Vcc(Max.)[V] 10.5
Iq[mA] 12.0
Ext. Gain No
Maximum Output Gain[dB] 30.0
I/F Stand alone
Speaker Amp Outputs 2.0
Speaker Amp THD+N[%] 0.2
Speaker Amp Input Type Analog Signal
Speaker Amp Type Class D
Speaker Amp Output Power(Max.)[W] 5
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 85
  • ・ Small output noise voltage capable of achieving a high S/N set
    ・ Support of power supply voltage ranging from 6V to 10.5V
    ・ Support of low current consumption mode
    ・ Built-in soft muting function for reducing pop at shut-down ON or OFF
    ・ Realization of high efficiency and low heat generation
    ・ Built-in function for reducing pop generation at disconnection from the outlet
    ・ Support of function for sampling frequency selection
    8) Realization of high reliability
    9) Support of ERROR pin
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Technical Data
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.