Sound Processors with built-in 2-band Equalizers - BD37512FS

This series supports common control software, increasing design and development efficiency. In addition, an internal 2-band equalizer enables the adjustment of the tone and bass signals without using external components, while 3 input selectors and 4ch independent volume and fader control ensure compatibility with 3 audio inputs and 4ch output (front/rear/left/right), contributing to greater space savings.

* This product is a STANDARD grade product and not recommend for on-vehicle devices.
Part number
Unit Quantity
Minimum Package Quantity
Packing Type
BD37512FS-E2 Active SSOP-A20 2000 2000 Taping Yes
Vcc(Min.)[V] 7.0
Vcc(Max.)[V] 9.5
Iq[mA] 15.0
Outputs 4
Volume Range 0to-40
Tone Control Band BASS, Treble
Number of of single input 3
Number of of ISO input 1
Input Gain[dB] 0to+20
FADER[dB] 0to-62, -∞
THD[%] 0.0050
Output Noise[µVrms] 6
Output voltage(Max.)[Vrms] 2.3
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 85
  • ・Reduce switching noise of mute, main volume, fader volume,
        bass, and treble by using advanced switch circuit
        [Possible to control all steps]
    ・Built-in ground isolation amplifier inputs,
        ideal for external stereo input.
    ・Decrease the number of external components by
        built-in 2-band equalizer filter.
        And, possible to control Gv of 2-band equalizer by
        I²C BUS control.
    ・It is possible for the bass, treble to the gain adjustment
        quantity of ±20dB and 1 dB step gain adjustment.
    ・Bi-CMOS process is suitable for the design of low current
        and low energy. And it provides more quality for
        small scale regulator and heat in a set.
    ・Package is SSOP-A20. Putting input-terminals together and
        output-terminals together can make PCB layout easier
        and can makes area of PCB smaller.)
    ・It is possible to control by 3.3V / 5V for I²C BUS.
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New Products:
Technical Data
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.