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Two colors integrated into an industry-small 1608 size ROHM Ultra-Compact Low-Profile 2-Color Chip LEDs
Broad chip LED lineup. ROHM's SML-D2 series integrates 2 colors in a compact 1608 package - the same size as conventional single-color chip LEDs.
Key Features
Class-leading compact size contributes to smaller, thinner devices
In addition to element miniaturization, the SML-D2 series leverages PICOLED ® *1）mounting and wire bonding*2）technologies to mount 2 chips (red and green) in a compact 1.6 x 0.8mm package – the same size as conventional single-color LEDs. Also, the extremely close configuration of color elements results in excellent color mixing properties that make it possible to produce not only red and green colors, but a number of intermediate colors as well.
Solder penetration countermeasure ensures superior reliability
Incorporating a stopper called a ‘resist' before the gold plating process blocks the gold pattern (that features good wettability). This prevents solder penetration into the resin, eliminating failures due to short-circuits and contributing to greater reliability.
Two colors integrated into an industry-small 1608 size
ROHM Ultra-Compact Low-Profile 2-Color Chip LEDs
Broad chip LED lineup.
ROHM's SML-D2 series integrates 2 colors in a compact 1608 package - the same size as conventional single-color chip LEDs.
Key Features
Class-leading compact size contributes to smaller, thinner devices
In addition to element miniaturization, the SML-D2 series leverages PICOLED ® *1）mounting and wire bonding*2）technologies to mount 2 chips (red and green) in a compact 1.6 x 0.8mm package – the same size as conventional single-color LEDs.
Also, the extremely close configuration of color elements results in excellent color mixing properties that make it possible to produce not only red and green colors, but a number of intermediate colors as well.
Solder penetration countermeasure ensures superior reliability
Incorporating a stopper called a ‘resist' before the gold plating process blocks the gold pattern (that features good wettability).
This prevents solder penetration into the resin, eliminating failures due to short-circuits and contributing to greater reliability.
Backside electrode configuration supports high-resolution display
Adopting a backside electrode design allows mounting in narrow spaces, enabling high-definition display in dot matrix and other applications.
Lineup
IF(mA)
VF(V)
λD(nm)
IV(mcd)
☆：Under development
※Different color combinations can be considered
※The products are under development and therefore the specifications may change without notice
Applications
＜Terminology＞
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