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The Industry's Smallest* Transistor Package Ultra-compact VML0806 package contributes to increased miniaturization and improved performance in smartphones
2012-10-03
*ROHM September 6, 2012 survey
ROHM recently announced the development of the smallest transistor package on the market optimized for thin, compact portable devices. The VML0806 measures just 0.8mm×0.6mm, with a height of only 0.36mm.
As portable devices such smartphones and digital cameras get smaller and more sophisticated, thinner, more compact components are required. However, until now, problems related to internal element miniaturization, bonding stability, package process accuracy, and surface mount technology limit the smallest conventional transistors to the 1006 size (1.0mm×0.6mm, t=0.37mm).
ROHM was able to overcome these challenges by utilizing a smaller element and high-precision package process technology, resulting in an unprecedentedly compact form factor. In addition, optimized external and terminal dimensions improve mountability while facilitating mass production.
ROHM will initially offer this new package for small-signal MOSFETs, reducing mounting area and thickness by 67% and 28%, respectively, compared with conventional 1212-sized (1.2mm×1.2mm, t=0.5mm) products while still maintaining characteristics and performance. Future implementations will include bipolar and digital transistors, which are expected to contribute to end-product miniaturization and higher-density designs for circuit applications of all types.
Key Features
Industry-small size minimizes mounting area Compared to the smallest conventional small-signal transistor available (1212 size: 1.2mm×1.2mm, t=0.50mm), mounting area is reduced 67% and thickness 28%.
The Industry's Smallest* Transistor Package
Ultra-compact VML0806 package contributes to increased miniaturization and improved performance in smartphones
ROHM recently announced the development of the smallest transistor package on the market optimized for thin, compact portable devices. The VML0806 measures just 0.8mm×0.6mm, with a height of only 0.36mm.
As portable devices such smartphones and digital cameras get smaller and more sophisticated, thinner, more compact components are required. However, until now, problems related to internal element miniaturization, bonding stability, package process accuracy, and surface mount technology limit the smallest conventional transistors to the 1006 size (1.0mm×0.6mm, t=0.37mm).
ROHM was able to overcome these challenges by utilizing a smaller element and high-precision package process technology, resulting in an unprecedentedly compact form factor. In addition, optimized external and terminal dimensions improve mountability while facilitating mass production.
ROHM will initially offer this new package for small-signal MOSFETs, reducing mounting area and thickness by 67% and 28%, respectively, compared with conventional 1212-sized (1.2mm×1.2mm, t=0.5mm) products while still maintaining characteristics and performance. Future implementations will include bipolar and digital transistors, which are expected to contribute to end-product miniaturization and higher-density designs for circuit applications of all types.
Key Features
Compared to the smallest conventional small-signal transistor available (1212 size: 1.2mm×1.2mm, t=0.50mm), mounting area is reduced 67% and thickness 28%.
Low ON resistance (2.6Ω）is enabled in an ultra-compact form factor.
Specifications
MOSFETs
Bipolar Transistors
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