Data Sheets

IC Packages

Although the package materials are listed under the packaging information, they are subject to change without notice. Therefore, please enter the part number in the RoHS Directive Compliance page to search for the relevant constituent material(s).

Clicking on the 3D icon will bring up a 3D image of the package, which can be rotated by dragging the mouse. (Note: Requires 3D-enabled browser or Adobe Reader 8.0 or later) Outline of the Packaging Information (Part No. Explanation and Package Ordering Units) is here.

Package Name	JEDEC Name	JEITA Name	Package Type	Package Category	Number of Terminals	Pitch [mm]	Size W x D x H (Max)[mm]
SOP8	—	—	IC	2-way surface mounting	8	1.27	5 x 6.2(t=1.71)

Package Type	Type	Number of Terminals	Pitch [mm]	Size W x D x H (Max)[mm]	3D Image
DIP-T8	DIP<Pin Pitch:2.54mm>	8	2.54	9.3 x 6.5 x 7.1	—
DIP14	DIP<Pin Pitch:2.54mm>	14	2.54	19.4 x 6.5 x 7.95	—
DIP16	DIP<Pin Pitch:2.54mm>	16	2.54	19.4 x 6.5 x 7.95	—
DIP18	DIP<Pin Pitch:2.54mm>	18	2.54	22.9 x 6.5 x 7.74	—

Package Type	Type	Number of Terminals	Pitch [mm]	Size W x D x H (Max)[mm]
MSOP8	Gull Wing	8	0.65	2.9 x 4 x 0.9
SOP4	Gull Wing	4	1.3	2 x 2.1 x 1.05
SSOP5	Gull Wing	5	0.95	2.9 x 2.8 x 1.25
SSOP6	Gull Wing	6	0.95	2.9 x 2.8 x 1.25

Package Type	Type	Number of Terminals	Pitch [mm]	Size W x D x H (Max)[mm]
HSOP25	HSOP<Pin Pitch:0.8mm>	25	0.8	13.6 x 7.8 x 2.11
HSOP25Z	HSOP<Pin Pitch:0.8mm>	25	0.8	13.6 x 7.8 x 2.11
HSOP28	HSOP<Pin Pitch:0.8mm>	28	0.8	18.5 x 9.9 x 2.41
HSOP-M28	HSOP<Pin Pitch:0.8mm>	28	0.8	18.5 x 9.9 x 2.41

Package Type	Type	Number of Terminals	Pitch [mm]	Size W x D x H (Max)[mm]	3D Image
HSON8	Non-Lead	8	0.65	2.9 x 3 x 0.6
HVSOF5	Non-Lead	5	0.5	1.6 x 1.6 x 0.6
HVSOF6	Non-Lead	6	0.5	1.6 x 3 x 0.75
SON008V5060	Non-Lead	8	1.27	5 x 6 x 1	—

Package Type	Type	Number of Terminals	Pitch [mm]	Size W x D x H (Max)[mm]
TO220FP-3	POWER-3PIN	3	2.54	10 x 30.5 x 4.6
TO220FP-5	POWER-5PIN	5	1.778	10 x 30.5 x 4.6
HRP5	POWER-5PIN	5	1.72	9.395 x 10.54 x 2.005
HRP7	POWER-7PIN	7	1.27	9.395 x 10.54 x 2.005