Data Sheets

IC Packages

Although the package materials are listed under the packaging information, they are subject to change without notice. Therefore, please enter the part number in the RoHS Directive Compliance page to search for the relevant constituent material(s).

Clicking on the 3D icon will bring up a 3D image of the package, which can be rotated by dragging the mouse. (Note: Requires 3D-enabled browser or Adobe Reader 8.0 or later) Outline of the Packaging Information (Part No. Explanation and Package Ordering Units) is here.

Package
Name
Package
Spec
JEDEC
Name
JEITA
Name
Package Type Package
Category
Number of
Terminals
Pitch [mm] Size W x D x H
(Max)[mm]
3D Image
SOP8 pdf icon IC 2-way surface mounting 8 1.27 5 x 6.2(t=1.71) 3D icon
                   
                   
                   
                   
Package Type Type Number of
Terminals
Pitch
[mm]
Size W x D x H
(Max)[mm]
External
Dimensions
Packaging
Information
Marking Land
Pattern
Soldering
Conditions
3D Image
DIP-T8 DIP<Pin Pitch:2.54mm> 8 2.54 9.3 x 6.5 x 7.1 pdf icon pdf icon pdf icon pdf icon pdf icon
DIP14 DIP<Pin Pitch:2.54mm> 14 2.54 19.4 x 6.5 x 7.95 pdf icon pdf icon pdf icon pdf icon pdf icon
DIP16 DIP<Pin Pitch:2.54mm> 16 2.54 19.4 x 6.5 x 7.95 pdf icon pdf icon pdf icon pdf icon pdf icon
DIP18 DIP<Pin Pitch:2.54mm> 18 2.54 22.9 x 6.5 x 7.74 pdf icon pdf icon pdf icon pdf icon pdf icon
Package Type Type Number of
Terminals
Pitch
[mm]
Size W x D x H
(Max)[mm]
External
Dimensions
Packaging
Information
Marking Land
Pattern
Soldering
Conditions
3D Image
MSOP8 Gull Wing 8 0.65 2.9 x 4 x 0.9 pdf icon pdf icon pdf icon pdf icon pdf icon 3D icon
SOP4 Gull Wing 4 1.3 2 x 2.1 x 1.05 pdf icon pdf icon pdf icon pdf icon pdf icon 3D icon
SSOP5 Gull Wing 5 0.95 2.9 x 2.8 x 1.25 pdf icon pdf icon pdf icon pdf icon pdf icon 3D icon
SSOP6 Gull Wing 6 0.95 2.9 x 2.8 x 1.25 pdf icon pdf icon pdf icon pdf icon pdf icon 3D icon
Package Type Type Number of
Terminals
Pitch
[mm]
Size W x D x H
(Max)[mm]
External
Dimensions
Packaging
Information
Marking Land
Pattern
Soldering
Conditions
3D Image
HSOP25 HSOP<Pin Pitch:0.8mm> 25 0.8 13.6 x 7.8 x 2.11 pdf icon pdf icon pdf icon pdf icon pdf icon 3D icon
HSOP25Z HSOP<Pin Pitch:0.8mm> 25 0.8 13.6 x 7.8 x 2.11 pdf icon pdf icon pdf icon pdf icon pdf icon 3D icon
HSOP28 HSOP<Pin Pitch:0.8mm> 28 0.8 18.5 x 9.9 x 2.41 pdf icon pdf icon pdf icon pdf icon pdf icon 3D icon
HSOP-M28 HSOP<Pin Pitch:0.8mm> 28 0.8 18.5 x 9.9 x 2.41 pdf icon pdf icon pdf icon pdf icon pdf icon 3D icon
Package Type Type Number of
Terminals
Pitch
[mm]
Size W x D x H
(Max)[mm]
External
Dimensions
Packaging
Information
Marking Land
Pattern
Soldering
Conditions
3D Image
HSON8 Non-Lead 8 0.65 2.9 x 3 x 0.6 pdf icon pdf icon pdf icon pdf icon pdf icon 3D icon
HVSOF5 Non-Lead 5 0.5 1.6 x 1.6 x 0.6 pdf icon pdf icon pdf icon pdf icon pdf icon 3D icon
HVSOF6 Non-Lead 6 0.5 1.6 x 3 x 0.75 pdf icon pdf icon pdf icon pdf icon pdf icon 3D icon
SON008V5060 Non-Lead 8 1.27 5 x 6 x 1 pdf icon pdf icon pdf icon pdf icon pdf icon
Package Type Type Number of
Terminals
Pitch
[mm]
Size W x D x H
(Max)[mm]
External
Dimensions
Packaging
Information
Marking Land
Pattern
Soldering
Conditions
3D Image
TO220FP-3 POWER-3PIN 3 2.54 10 x 30.5 x 4.6 pdf icon pdf icon pdf icon pdf icon pdf icon 3D icon
TO220FP-5 POWER-5PIN 5 1.778 10 x 30.5 x 4.6 pdf icon pdf icon pdf icon pdf icon pdf icon 3D icon
HRP5 POWER-5PIN 5 1.72 9.395 x 10.54 x 2.005 pdf icon pdf icon pdf icon pdf icon pdf icon 3D icon
HRP7 POWER-7PIN 7 1.27 9.395 x 10.54 x 2.005 pdf icon pdf icon pdf icon pdf icon pdf icon 3D icon