Does the insulation resistance of the upper portion of the element product mold degrade when pressed by a metal spring?|FAQ|ROHM Semiconductor

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Does the insulation resistance of the upper portion of the element product mold degrade when pressed by a metal spring?
- The exposed metal sections (heat sink at back of package and bare metal section at the notch) are at the same potential as the drain.
  As a result, for products where the package includes a backside heat sink the creepage distance may be insufficient.
  Therefore, we ask that the user confirm the guidelines for creepage distance, taking into account the operating environment.