UMD12NFHA
NPN+PNP, SOT-363, Dual Digital Transistor (Bias Resistor Built-in Transistor) for automotive

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

Product Detail

 
Part Number | UMD12NFHATR
Status | Active
Package | UMT6
Unit Quantity | 3000
Minimum Package Quantity | 3000
Packing Type | Taping
RoHS | Yes

Specifications:

Supply Status

Active

Package Code

SOT-363

JEITA Package

SC-88

Number of terminal

6

Polarity

NPN+PNP

Supply voltage VCC 1[V]

50

Collector current Io (Ic) [A]

0.1

Input resistance R1 1[kΩ]

47

Emitter base Resistance R2 1[kΩ]

47

Supply voltage VCC 2[V]

-50

Collector current IC 2[A]

-0.1

Input resistance R1 2[kΩ]

47

Emitter base Resistance R2 2[kΩ]

47

Power Dissipation (PD)[W]

0.15

Mounting Style

Surface mount

Equivalent (Single Part)

DTA144E / DTC144E

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Package Size [mm]

2x2.1 (t=1)

Common Standard

AEC-Q101 (Automotive Grade)

Find Similar

Features:

· Ultra-compact complex digital transistor
· Built-In Biasing Resistors
· Potential divider type
· Small Surface Mount Package
· Pb Free/RoHS Compliant

Similar Products

 

Different Grade

UMD12N   Grade| Standard StatusActive

Reference Design / Application Evaluation Kit

 
    • Reference Design - REF66004
    • Power and Interface solution for X9M/X9E of SemiDrive's Infotainment SoC
    • ROHM has developed an optimal power supply/interface reference design for SemiDrive's next-generation cockpit SoC "X9M/X9E". By providing an optimal power supply and interface reference design for the "X9M/X9E", ROHM is helping to reduce the development burden on designers and achieve the performance required by the market. SemiDrive's latest automotive SoC "X9M/X9E", for which the reference design has been developed, will contribute to the enhancement of various in-vehicle applications, including cockpits.

      Click here for inquiries about SemiDrive's next-generation cockpit SoC "X9M/X9E".


      • Scalable PMIC (BD96801Q12) optimized for use with "X9M/X9E"
      • SerDes IC (BU18xMxx) optimized for automotive camera modules
      • SerDes IC (BU18xL82) supporting full HD (1,980 × 1,080 pixels) for automotive displays with multiple screens
      • Interface IC (BU92RTF82) that contributes to functional safety of in-vehicle displays
      • Automotive 2.7V to 5.5V Input, 12A 1ch, Buck DC-DC Converter IC Integrated FET (BD9SA01F80)

      This reference design consists of three boards. Each is shown below.

      • REF66004-EVK-001 (Core Board)
      • REF66004-EVK-002 (SerDes Board)
      • REF66004-EVK-003 (Display Board)

      Related News:
      ROHM Partners with Nanjing SemiDrive Technology Ltd., China’s SoC Manufacturer of Next-Generation Cockpits, to Develop Automotive Solutions