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Low Duty LCD Segment Drivers for Automotive applications - BU91797MUF-M

BU91797MUF-M is a 1/4 duty general-purpose LCD driver that can be used for automotive applications and can drive up to 144 LCD Segments.
This product can support VA LCD displays, which has better optical performance with higher LCD voltage driving and higher frame frequency driving.
It can support operating temperature of up to +105℃ and is qualified for AEC-Q100 Grade2, as required for automotive applications.
It has integrated display RAM for reducing CPU load. Also, it is designed with low power consumption and no external component needed.
Wettable flank QFN package is suitable for small footprint applications and provides significant advantages in inspectability and solder joint reliability.

Additional Information  
FAQ 
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número de peça
Estado de Condição
pacote
Quantidade Unidade
Quantidade mínima Package
tipo de embalagem
RoHS
BU91797MUF-ME2 Active VQFN48FV7070 1500 1500 Taping sim
 
especificações:
Grade Automotive
Segment Element 144
Duty 1/4
Bias 1/3
Elements of MUX 1:4 144
Interface [line serial] 2wire
Interface Voltage (Min.)[V] 2.5
Interface Voltage (Max.)[V] 6.0
LCD Driving Waveform Line/Frame
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 105
mais
características:
    • 1/4duty driving: Max 144 segments
    • Integrated display data RAM: 36 x 4bit
    • 1/3 bias setting
    • Support wide range of operation voltage from 2.5V to 6.0V, which can support TN LCD and VA LCD display.
    • Integrated LCD voltage driving circuit
    • Integrated oscillation circuit for LCD frame frequency
    • Line or Frame inversion driving selectable
    • Support 2 wire serial interface
    • Integrated power on reset circuit
    • No external components required
    • Low power consumption design
    • Small wettable flanks QFN package improved in inspectability and reliability
    • Support up to +105℃ operation, qualified AEC-Q100 Grade2
mais
 
 
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Dados técnicos
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.

Part Explanation

For ICs