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Automotive Microwire BUS 2Kbit (128x16bit) EEPROM - BR93H56RFJ-2CBR93H56-2C is a serial EEPROM of serial 3-line interface method.
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especificações:
Grade | Automotive |
I/F | MicroWire BUS(3-Wire) |
Density [bit] | 2K |
Bit Format [Word x Bit] | 128 x 16 |
Package | SOP-J8 |
Operating Temperature (Min.)[°C] | -40 |
Operating Temperature (Max.)[°C] | 125 |
Vcc(Min.)[V] | 2.5 |
Vcc(Max.)[V] | 5.5 |
Circuit Current (Max.)[mA] | 3.0 |
Standby Current (Max.)[μA] | 10.0 |
Write Cycle (Max.)[ms] | 4.0 |
Input Frequency (Max.)[Hz] | 2M |
Endurance (Max.)[Cycle] | 106 |
Data Retention (Max.)[Year] | 100 |
características:
- ・ Conforming to Microwire BUS
・ Withstands electrostatic voltage 6kV (HBM method typ.)
・ Wide temperature range -40℃ to +125℃ (-40℃ to +85℃, -40℃ to +105℃ in other series)
・ Same package line up and same pin configuration
・ 2.5V to 5.5V single supply voltage operation
・ Address auto increment function at read operation
・ Write mistake prevention function Write prohibition at power on Write prohibition by command code Write mistake prevention circuit at low voltage
・ Program cycle auto erase and auto end function
・ Program condition display by READY / BUSY
・ Low current consumption At write operation (at 5V) : 0.8mA (Typ.) At read operation (at 5V) : 0.5mA (Typ.) At standby operation (at 5V) : 0.1μA (Typ.) (CMOS input)
・ Compact package MSOP8 / TSSOP-B8 / SOP8 / SOP-J8
・ High reliability by ROHM original Double-Cell structure
・ Data retention for 20 years(Ta≦125℃)
・ Endurance up to 300,000 cycles(Ta≦125℃)
・ Data at shipment all address FFFFh
PRODUTOS RELACIONADOS
Outros Novo / Atualizado produtos em relação aMemory
Número de peça | Nome do Produto | Pacote | Datasheet | Inventário de distribuição |
---|---|---|---|---|
BR93H56RF-2C | Automotive Microwire BUS 2Kbit (128x16bit) EEPROM | SOP8 | comprar | |
BR93H56RFVT-2C | Automotive Microwire BUS 2Kbit (128x16bit) EEPROM | TSSOP-B8 | comprar | |
BR93H56RFVM-2C | Automotive Microwire BUS 2Kbit (128x16bit) EEPROM | MSOP8 | comprar |
New Products:
Dados técnicos
Thermal Resistance
The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
Part Explanation
For ICs