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Microwire BUS 2Kbit (128x16bit) EEPROM - BR93G56FVT-3

BR93G56-3 is serial EEPROM of serial 3-line Interface method.
They are dual organization(by 16bit or 8bit) and it is selected by the input of ORG PIN.

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FAQ 
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* This product is a STANDARD grade product and not recommend for on-vehicle devices.
número de peça
Estado de Condição
pacote
Quantidade Unidade
Quantidade mínima Package
tipo de embalagem
RoHS
BR93G56FVT-3GE2 Active TSSOP-B8 3000 3000 Taping sim
 
especificações:
Grade Standard
I/F MicroWire BUS(3-Wire)
Density [bit] 2K
Bit Format [Word x Bit] 128 x 16 / 256 x 8
Package TSSOP-B8
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 85
Vcc(Min.)[V] 1.7
Vcc(Max.)[V] 5.5
Circuit Current (Max.)[mA] 3.0
Standby Current (Max.)[μA] 2.0
Write Cycle (Max.)[ms] 5.0
Input Frequency (Max.)[Hz] 3M
Endurance (Max.)[Cycle] 106
Data Retention (Max.)[Year] 40
Comment Selectable the format(16bit or 8bit) by ORG-pin. Cu wire.
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características:
  • ・ 3-line communications of chip select, serial clock, serial data input / output (the case where input and output are shared)
    ・ Actions available at high speed 3MHz clock (4.5 V~5.5 V)
    ・ High speed write available (write time 5ms max.）
    ・ Same package and pin layout from 1Kbit to 16Kbit
    ・ 1.7~5.5V single power source action
    ・ Address auto increment function at read action
    ・ Write mistake prevention function » Write prohibition at power on » Write prohibition by command code » Write mistake prevention function at low voltage
    ・ Program cycle auto delete and auto end function
    ・ Program condition display by READY / BUSY
    ・ Dual organization : by 16 bit (X16) or 8 bit (X8)
    ・ Compact package SOP8/SOP-J8/SSOP-B8/TSSOP-B8/MSOP8/ TSSOP-B8J/DIP-T8/VSON008X2030
    ・ Data retention for 40 years
    ・ Data rewrite up to 1,000,000 times
    ・ Data at shipment all addresses FFFFh (X16) or FFh (X8)
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Dados técnicos
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.

Part Explanation

For ICs