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125°C Operation SPI BUS EEPROM - BR25H128FVT-2ACBR25H128FVT-2AC is a 128Kbit Serial EEPROM of SPI BUS interface method.
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especificações:
Grade | Automotive |
I/F | SPI BUS |
Density [bit] | 128K |
Bit Format [Word x Bit] | 16K x 8 |
Package | TSSOP-B8 |
Operating Temperature (Min.)[°C] | -40 |
Operating Temperature (Max.)[°C] | 125 |
Vcc(Min.)[V] | 2.5 |
Vcc(Max.)[V] | 5.5 |
Circuit Current (Max.)[mA] | 5.5 |
Standby Current (Max.)[μA] | 10.0 |
Write Cycle (Max.)[ms] | 4.0 |
Input Frequency (Max.)[Hz] | 10M |
Endurance (Max.)[Cycle] | 106 |
Data Retention (Max.)[Year] | 100 |
características:
- SPI BUS interface (CPOL, CPHA)=(0,0), (1,1)
- Voltage Range: 2.5V to 5.5V
- Operating Range: -40°C to +125°C
- Clock Frequency: 10MHz(Max)
- Write Time: 4ms(Max)
- Page Size: 64bytes
- Bit Format: 16384 x 8bit
- 64bytes Write Lockable Identification Page (ID Page)
- Address Auto Increment Function at Read Operation
- Auto Erase and Auto End Function at Data Rewrite
- Write Protect Block Setting by Software Memory Array 1/4, 1/2, Whole
- HOLD Function by HOLDB Pin
- Low Supply Current
Write Operation (5V): 1.0mA (Typ)
Read Operation (5V): 1.2mA (Typ)
Standby State (5V): 0.1µA (Typ) - Prevention of Write Mistake
Write prohibition at Power On
Write prohibition by WPB Pin
Write prohibition Block Setting
Prevention of Write Mistake at Low Voltage - Write Cycles
: 1,000,000 Write Cycles (Ta≤85°C)
: 500,000 Write Cycles (Ta≤105°C)
: 300,000 Write Cycles (Ta≤125°C) - Data Retention
: 100 Years (Ta≤25°C)
: 60 Years (Ta≤105°C)
: 50 Years (Ta≤125°C) - Data at Shipment
Memory Array: FFh
ID Page First 3 Addresses: 2Fh, 00h, 0Eh
Other Addresses: FFh
Status Register WPEN, BP1, BP0: 0, 0, 0
Lock Status LS: 0 - TSSOP-B8, SOP8, SOP-J8 Packages
- AEC-Q100 Qualified
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Número de peça | Nome do Produto | Pacote | Datasheet | Inventário de distribuição |
---|---|---|---|---|
BR25H128F-2AC | 125°C Operation SPI BUS EEPROM | SOP8 | comprar | |
BR25H128FJ-2AC | 125°C Operation SPI BUS EEPROM | SOP-J8 | comprar |
New Products:
Dados técnicos
Thermal Resistance
The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
Part Explanation
For ICs