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Power Management LSI for Mobile Phone - BD7185AGWL

The BD7185AGWL is an integrated Power Management LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by- 3.8mm Wafer-level CSP package, which is designed to meet demands for space-constrained Smart phones.

The device provides 5-Buck Converters.
The device also includes 12 general-purpose LDOs providing a wide range of voltage and current capabilities.

All Buck Converters and LDOs are fully controllable by the I2C interface. The BD7185AGWL is very easy to use in any mobile platforms.

FAQ 
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* This product is a STANDARD grade product and not recommend for on-vehicle devices.
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Quantidade mínima Package
tipo de embalagem
Constituição Lista de Materiais
RoHS
BD7185AGWL-E2 Active UCSP50L3C 2500 2500 Taping inquiry sim
 
especificações:
ch 5
Vin1(Min.)[V] 2.6
Vin1(Max.)[V] 5.5
Serial I/F I2C
Operating Temperature (Min.)[°C] -35
Operating Temperature (Max.)[°C] 85
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características:
  • · 5-channel high-efficiency Buck Converters
      (16-step adjustable VO by I2C)
    · 12-channel CMOS-type LDO
      (16-step adjustable VO by I2C)
    · LDO and Buck Converter power ON/OFF control by
      I2C interface or external pin.
    · Power ON/OFF sequence.
    · 32.768kHz OSC and output buffer.
    · 4-to-1 analog switch.
    · TCXO buffer.
    · SIM card I/F
    · I2C compatible Interface.
    · I2C device address changeable by ADRS pin.
      (Device address is “1001011”,”1001100”)
    · Small and thin CSP package
      (3.8mm × 3.8mm height 0.57mm max)
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Pin Configuração:
Pin Configration
 
 
 
 
Dados técnicos
Application Note

Thermal Resistance

Part Explanation

For ICs