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Power Management LSI for Mobile Phone - BD7185AGWL

The BD7185AGWL is an integrated Power Management LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by- 3.8mm Wafer-level CSP package, which is designed to meet demands for space-constrained Smart phones.

The device provides 5-Buck Converters.
The device also includes 12 general-purpose LDOs providing a wide range of voltage and current capabilities.

All Buck Converters and LDOs are fully controllable by the I²C interface. The BD7185AGWL is very easy to use in any mobile platforms.

Additional Information  
FAQ 
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Please contact us for purchase because there is no distribution Inventory.--- inquérito
* This product is a STANDARD grade product and not recommend for on-vehicle devices.
número de peça
Estado de Condição
pacote
Quantidade Unidade
Quantidade mínima Package
tipo de embalagem
RoHS
BD7185AGWL-E2 Active UCSP50L3C 2500 2500 Taping sim
 
especificações:
ch 5
Vin1(Min.)[V] 2.6
Vin1(Max.)[V] 5.5
Serial I/F I2C
Operating Temperature (Min.)[°C] -35
Operating Temperature (Max.)[°C] 85
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características:
  • · 5-channel high-efficiency Buck Converters
      (16-step adjustable VO by I²C)
    · 12-channel CMOS-type LDO
      (16-step adjustable VO by I²C)
    · LDO and Buck Converter power ON/OFF control by
      I²C interface or external pin.
    · Power ON/OFF sequence.
    · 32.768kHz OSC and output buffer.
    · 4-to-1 analog switch.
    · TCXO buffer.
    · SIM card I/F
    · I²C compatible Interface.
    · I²C device address changeable by ADRS pin.
      (Device address is “1001011”,”1001100”)
    · Small and thin CSP package
      (3.8mm × 3.8mm height 0.57mm max)
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Pin Configuração:
Pin Configration
 
 
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Dados técnicos
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.

Part Explanation

For ICs