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Power Management LSI for Mobile Phone - BD7185AGWL
The BD7185AGWL is an integrated Power Management LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by- 3.8mm Wafer-level CSP package, which is designed to meet demands for space-constrained Smart phones.
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* This product is a STANDARD grade product and not recommend for on-vehicle devices. |
especificações:
ch | 5 |
Vin1(Min.)[V] | 2.6 |
Vin1(Max.)[V] | 5.5 |
Serial I/F | I2C |
Operating Temperature (Min.)[°C] | -35 |
Operating Temperature (Max.)[°C] | 85 |
características:
- · 5-channel high-efficiency Buck Converters
(16-step adjustable VO by I²C)
· 12-channel CMOS-type LDO
(16-step adjustable VO by I²C)
· LDO and Buck Converter power ON/OFF control by
I²C interface or external pin.
· Power ON/OFF sequence.
· 32.768kHz OSC and output buffer.
· 4-to-1 analog switch.
· TCXO buffer.
· SIM card I/F
· I²C compatible Interface.
· I²C device address changeable by ADRS pin.
(Device address is “1001011”,”1001100”)
· Small and thin CSP package
(3.8mm × 3.8mm height 0.57mm max)
Pin Configuração:
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New Products:
Dados técnicos
Thermal Resistance
The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
Part Explanation
For ICs