Power Management LSI for Mobile Phone - BD71801GWL

The BD71801GWL is an integrated Power Management LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by-3.8mm Wafer-level CSP package, which is designed to meet demands for space-constrained Smart phones.
The device provides 5-Buck Converters. The device also includes 12 general-purpose LDOs providing a wide range of voltage and current capabilities.
All Buck Converters and LDOs are fully controllable by the I²C interface. The BD71801GWL is very easy to use in any mobile platforms.

* This product is a STANDARD grade product and not recommend for on-vehicle devices.
número de peça
Estado de Condição
Quantidade Unidade
Quantidade mínima Package
tipo de embalagem
BD71801GWL-E2 Active UCSP50L3C 2500 2500 Taping sim
ch 5
Vin1(Min.)[V] 2.6
Vin1(Max.)[V] 5.5
Serial I/F I2C
Operating Temperature (Min.)[°C] -35
Operating Temperature (Max.)[°C] 85
  • · 5-Channel High Efficiency Step-down Converters.
      (Adjustable Voltage Options by I²C)
      (Switching frequency 2MHz(TYP))
    · All Buck Converters Support PFM/PWM Auto Mode.
    · 12-Channel LDOs are Programmable to Voltage Options by I²C.
    · LDOs and all Buck Converters Power ON/OFF Control Enabled by I²C Interface or External pin.
    · 2ch NMOS output LDOs (LDO11, 12) for Optimized Efficiency.
    · Power ON/OFF Sequence.
    · Support TCXO Buffer (26MHz) and 32KHz crystal oscillator.
    · I²C Compatible Interface.
      (I²C Clock Support : Full Speed Mode 400kHz)
      (Device Address is "1001011","1001100")
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Dados técnicos
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.