Multi-channel Power Supply IC for Car Audio Systems - BD49101ARFS-M

The BD49101ARFS-M LSI is a multi-channel power supply IC that can provide all necessary supply voltages for automobile audio systems. The IC has two Switching Power Supplies (DCDC), five Regulators (REG) and a High Side switch. This single power supply system can provide the required voltages to all systems including the MCU, CD, tuner, USB, illumination, audio circuits and others. The IC system is based on switching regulator which has high efficiency then you can suppress heat of IC than before. And it has low power mode operation or voltage control function so that you can get (1)High Efficiency (2)Low IQ and (3)easiness of power supply design.

número de peça
Estado de Condição
Quantidade Unidade
Quantidade mínima Package
tipo de embalagem
BD49101ARFS-ME2 Active HTSSOP-A44R 1500 1500 Taping sim
Grade Automotive
ch 7
Vin1(Min.)[V] 5.5
Vin1(Max.)[V] 25.0
SW frequency(Max.)[MHz] 0.5
Circuit Current(Typ.)[mA] 5.0
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 85
    • AEC-Q100 Qualified
    • Integrated 7 channels of Power Supply for Car Audio
      • 2 DCDC (Integrated 1 Controller )
      • 5 REG
    • 1 High Side Switch channel
    • Integrated Low Power Standby REG for MCU Power Supply
    • REG4 Cable Impedance Compensation
    • I²C Interface
    • Selectable Oscillator Frequency using External Resistance
    • External Clock Synchronization
    • Power Supply Control Function (Power on/off Sequencer).
    • Low Voltage, Over Voltage and REG4 Over Current Detect Flag
    • Integrated Protection Circuitry:
      • Over Voltage Input Protection
      • Over Current Protection
      • Thermal Shutdown
Outros Novo / Atualizado produtos em relação aPower Management
Número de peça Nome do Produto Pacote Datasheet Inventário de distribuição
BD49101AEFS-M Multi-channel Power Supply IC for Car Audio Systems HTSSOP-A44   comprar
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Dados técnicos
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.