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Sound Processors with built-in 3-band Equalizers - BD37532FVThis series supports common control software, increasing design and development efficiency. Tone quality can be adjusted by parametric equalizer using no external components. The built-in three-band equalizer sub woofer output allows for a space saving design.
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* This product is a STANDARD grade product and not recommend for on-vehicle devices. |
especificações:
Vcc(Min.)[V] | 7.0 |
Vcc(Max.)[V] | 9.5 |
Iq[mA] | 38.0 |
I/F | I2C BUS |
Outputs | 6 |
Volume Range | +15to-79, -∞ |
Tone Control Band | BASS, Middle, Treble |
Number of of single input | 2/3/5 |
Number of of ISO input | 3/2/1 |
Input Gain[dB] | 0to+20 |
Parametric EQ | Yes |
LOUDNESS | Yes |
FADER[dB] | +15to-79, -∞ |
LPF/HPF for SUB WOOFER | LPF |
THD[%] | 0.0010 |
Output Noise[µVrms] | 3.8 |
Output voltage(Max.)[Vrms] | 2.3 |
Operating Temperature (Min.)[°C] | -40 |
Operating Temperature (Max.)[°C] | 85 |
características:
- ・Reduce switching noise of input gain control, mute, main volume,
fader volume, bass, middle, treble, loudness, by using advanced switch circuit
[Possible to control all steps]
・Built-in ground isolation amplifier inputs, ideal for external stereo input.
・Built-in differential input selector that can make various combination of
single-ended / differential input.
・Built-in input gain controller reduce switching noise for volume of
a portable audio input.
・Decrease the number of external components by
built-in 3-band equalizer filter, LPF for subwoofer, loudness filter,
And, possible to control Q, Gv, fo of 3-band equalizer and fc of LPF,
and fo, Gv of loudness by I²C BUS control freely.
・It is possible for the bass, middle, treble to the gain adjustment
quantity of ±20dB and 1 dB step gain adjustment.
・It is equipped with output terminals of Subwoofer.
Moreover, the stereo signal of the front and rear also
can be output by the I²C BUS control.
・Bi-CMOS process is suitable for the design of low current and low energy.
And it provides more quality for small-scale regulator and heat in a set.
・Package is SSOP-B28. Putting input-terminals together
and output-terminals together can make PCB layout easier
and can makes area of PCB smaller.
・It is possible to control by 3.3V / 5V for I²C BUS.
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New Products:
Dados técnicos
Thermal Resistance
The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
Part Explanation
For ICs