Downloading...
Automotive IPS series 1ch High-side switch - BD1HC500FVM-CBD1HC500FVM-C is an Automotive 1ch High-Side switch. It has a built-in overcurrent protection circuit, Thermal Shut Down (TSD) circuit, Open Load Detection circuit, Under Voltage Lock Out circuit, and has diagnostic (ST) output function at the time during abnormal detection.
| ||||
especificações:
Grade | Automotive |
Channel Number [ch] | 1 |
Drain-Source Voltage (Max.)[V] | 44.5 |
Output Current[A] | 0.8 |
ON Resistance [mΩ] | 500 |
Over Current Detect [A] | 0.8 |
Active Clamp Energy [mJ] | 33.0 |
Supply Voltage(Min.)[V] | 4 |
Supply Voltage(Max.)[V] | 18 |
Current consumption(Typ.)[µA] | 1500 |
Thermal Shut Down | Off-Latch |
Open Load Detect [V] | 2.8 |
Status Terminal | Available |
Junction Temperature Tj (Min.)[°C] | -40 |
Junction Temperature Tj (Max.)[°C] | 150 |
características:
- Built-in overcurrent protection circuit
- Built-in Thermal Shut Down (TSD)
- Built-in Open Load Detection circuit (When Output is OFF)
- Possibility to control directly from CMOS logic IC
- Low standby current
- Built-in Under Voltage Lock Out circuit
- Built-in diagnostic (ST) output function
- Low On resistance of RDS (ON) =500mΩ (Typ) (VDD=12V, Ta=25°C, IOUT=0.25A)
- Monolithic power IC that has a built in control part (CMOS) and a power MOS FET on 1chip
- 1ch High-side switch for the mechanical relay coil drive
- AEC-Q100 qualified
PRODUTOS RELACIONADOS
Outros Novo / Atualizado produtos em relação aPower Management
Número de peça | Nome do Produto | Pacote | Datasheet | Inventário de distribuição |
---|---|---|---|---|
BD1HC500EFJ-C | Automotive IPS series 1ch High-side switch | HTSOP-J8 | comprar | |
BD1HC500HFN-C | Automotive IPS series 1ch High-side switch | HSON8 | comprar | |
BD1HD500EFJ-C | Automotive IPS series 1ch High-side switch | HTSOP-J8 | comprar | |
BD1HD500HFN-C | Automotive IPS series 1ch High-side switch | HSON8 | comprar | |
BD1HD500FVM-C | Automotive IPS series 1ch High-side switch | MSOP8 | comprar |
New Products:
Dados técnicos
Thermal Resistance
The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
Part Explanation
For ICs