Cell Balance LSI of 4 to 6 Series Power Storage Element Cells for Automotive - BD14000EFV-C

BD14000EFV is a LSI IC designed as a self-controlled cell balancer. It has a built-in shunt-type power storage element balancer function that can respond to 4 to 6 cells. All the functions necessary in a cell balancer are built-in making power storage element cell balancing possible only in this LSI. This chip can be used for electric double layer capacitors (EDLC) with cell detection voltage range of 2.4V to 3.1V and power storage capacitors which is important for cell balancers with similar electrical characteristics It has a built-in multiple over-voltage detection function and can also detect abnormal mode such as any characteristic deterioration in cells. Also, application-dependent operation can be set since enable control is possible.

Small Reel (250pcs) is available.→BD14000EFV-CH2

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Evaluation board User's Guide

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número de peça
Estado de Condição
Quantidade Unidade
Quantidade mínima Package
tipo de embalagem
BD14000EFV-CE2 Active HTSSOP-B30 2000 2000 Taping sim
Grade Automotive
Common Standard AEC-Q100
Supply Voltage(Min.)[V] 8.0
Supply Voltage(Max.)[V] 24.0
ON Resistance [mΩ] 1
Cell Voltage Detection (Min.)[V] 2.4
Cell Voltage Detection (Max.)[V] 3.1
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 105
Package HTSSOP-B30
    • AEC-Q100 qualified
    • All EDLC cell balancer functions are integrated on a single chip
    • Self- controlled EDLC balance function
    • Adopts shunt resistance method for simple balancing
    • 4 to 6 cell series connection ready
    • Multiple chip series connection is possible
    • Built-in over-voltage detection flag output
    • Detection voltage can be set
Outros Novo / Atualizado produtos em relação aPower Management
Número de peça Nome do Produto Pacote Datasheet Inventário de distribuição
BD14000EFV-C(H2) Cell Balance LSI of 4 to 6 Series Power Storage Element Cells for Automotive HTSSOP-B30  
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Evaluation Board User's Guide

User's guide of BD14000EFV-C Evaluation Board

Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.