Enhancing performance through significant reduction of size and weight ROHM has announced to provide the full SiC power modul..
High heat dissipation and reliability ideal for automotive and industrial equipment Kyoto and Santa Clara, Calif., – November..
Unprecedented noise immunity contributes to improved reliability and simpler designs in automotive sensor applications ROHM h..
Optimized design with built-in memory improves performance while contributing to greater miniaturization ROHM has recently an..
Proprietary Nano Pulse Control technology contributes to increased performance in 48V automotive systems ROHM has recently an..
Supports both Sigfox and IEEE802.15.4k standards and expands transmission range by more than 10 times for IoT equipment Yokoh..
Industry-small form factor contributes to thinner, more vibrant displays in industrial and consumer devices Kyoto and Santa C..
Facilitates prototyping and initial set development of USBPD applications ranging from mobile devices to larger 100W class eq..
14 June 2017 The chip is expected to enable more efficient prediction of machine failures by processing and analyzing data ga..
Contributes to improved safety, greater reliability, and shorter development time for Li-ion battery packs *LEV stands for Li..
New 1200V/400A and 600A models contribute to greater efficiency and miniaturization in high-power applications ROHM has recen..
March 15, 2013 This is to notify that ROHM Co., Ltd. resolved to suspend the business of and dissolve its consolidated subsid..
2013-01-23 LAPIS Semiconductor Co., Ltd. (Yokohama, Japan), subsidiary of ROHM Co., Ltd. today announced agreement under whic..
2012-10-18 Kyoto, Japan –ROHM Co., Ltd., a leading Japanese semiconductor manufacturer, today announced that it has become th..
2012-05-17 Willich-Münchheide/Nuremberg, May 8th 2012 - During the opening ceremony of PCIM Europe 2012 Conference the "Best ..