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SiC SBDs

Features | Key Feature 1 | Key Feature 2 | Applications | Key Feature 3 | Related Products

SiC Schottky barrier diodes are now available for high voltage resistance, large current circuits. High-speed switching characteristics minimize switching loss, improving device operating frequency.

Features

  • Short recovery time
  • Supports high-speed switching
  • Low temperature dependence

Key Ratings
Rated Voltage Rated Current
600V 10A
SiC SBD Wafer

Key Feature 1 : Dramatically lower switching loss

Ultra-short reverse recovery time (impossible to achieve with silicon) enables high-speed switching. This minimizes the reverse recovery charge (Qrr), reducing switching loss significantly, contributing to end-product miniaturization.


Switching Waveforms
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In addition, SiC devices maintain a constant trr regardless of temperature, unlike conventional silicon fast recovery diodes where the trr increases with temperature.
This enables high-temperature driving without increasing switching loss.

trr Temperature Characteristics
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Key Feature 2 : Stable temperature characteristics

SiC diodes exhibit stabler temperature characteristics (i.e. forward voltage) compared with silicon-based devices, simplifying parallel connection(s) and preventing thermal runaway - unlike Si FRDs.

SBD : Forward Characteristics
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Applications

  • Switching circuits
  • Motor drive circuits
  • PFC (Power Factor Correction) circuits and others
SiC-SBD wafer image

Key Feature 3 : Complete Manufacturing Process from development to production

SiC wafer supplier SiCrystal has joined the ROHM Group. This makes it possible to perform manufacturing completely in-house, from ingot formation to power device fabrication, resulting in cutting-edge products with superior reliability and quality. SiCrystal AG

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