ICs

Discrete
 Semiconductors

Opto Electronics

Passive Components

Modules
 (Sub Systems)

Energy Saving!ECO Devices

Printheads

Printheads CG Series
Printheads CG Series

Features

X-coatLarge PlatensNo Heat Sink required

Compatible to both high quality printing and power saving, by employing the best heat element structure suitable for printing at 150mm/s. High frequency clock drive enable the precise thermalheads controlling.


Part No. Resolutions
(dpi)		 Print
width
(mm)		 Resistance
variation
(Ω)		 Platen
diameter
(max.)(φ)		 Print
speed
(mm/s)		 Logic
voltage
(V)		 Supply
voltage
(V)
KD2002-CG10A 203 54 800 20 100 to 200 3.13 to 5.25 24
KD2003-CG10A 203 72 800 20 100 to 200 3.13 to 5.25 24
KD2004-CG10A 203 108 800 20 100 to 200 3.13 to 5.25 24
KD2008-CG50A 203 216 800 20 100 to 200 4.75 to 5.25 24

 

X-coat X-coat
Conductive layer prevents heat element damage caused by ESD generated by print media.
Large Platens Large Platens
Prints against platen as large as 20mn in diameter.
No Heat Sink required No Heat Sink required
Simplified structure in which all functions are integrated into one board enables supplying the product without heat sink.

 Thermal Printheads

2008.09.05

SH series of ultra-high speed (1300mm/s) thermal printheads

2008.03.14

Frictionless Thermal Printheads: SE Series

2007.10.18

The Industry's First 250mm/s 48-tone Thermal Printheads for High-speed Graphics Printing