ROHM Selects QUALCOMM's MDDI Solution for the Development of MDDI-Compatible 3G Mobile Phones

ROHM CO., LTD. today announced the company has selected QUALCOMM's Mobile Display Digital Interface (MDDI) solution for 3G mobile phones. QUALCOMM's MDDI solution is a high-speed serial interface technology, an implementation of the Video Electronics Standards Association (VESA) MDDI standard, and is designed to increase the reliability and reduce the power demands of clamshell phones.

Utilizing QUALCOMM's MDDI technology will enable large volumes of data to be transferred at high speeds between QUALCOMM's baseband CDMA2000 and WCDMA (UMTS) Mobile Station ModemTM (MSM^TM) chipsets and display components of the handset, including cameras and LCDs. By reducing the number of wires that run across the hinge of a clamshell phone, the overall design of the handset is simplified and wireless device manufacturer development costs are reduced.

ROHM develops (LSI) solutions for mobile phones, many of which have been adopted in market products, including the LCD drivers for mobile phones and LSIs for camera image processing. With 3G mobile phones being widely adopted and continuing to gain traction, interface technology that can transfer large volumes of data at high speeds is an essential component to support new picture-related features. ROHM's LSIs will be enabled by QUALCOMM's high-speed serial interface technology to more efficiently and reliably support next-generation, high-functionality mobile phones -- as well as deliver low-EMI (electromagnetic interference), power-saving data transfer for mobile phones, thereby contributing to higher-quality products.

Rapidly-spreading 3G mobile phones have seen a stupendous growth in the amount of data transferred due to higher resolution and number of colors in the displays, as well as higher-pixel cameras, causing problems with EMI noise due to the greater number of wires in hinge section. At the same time, a mobile phone's design has become an important factor in product differentiation, so many have flip-top or swiveling displays with complex hinge mechanisms. Such body designs have been hampered by a greater number of wires inside and measures to suppress EMI noise, which also lead to a drop in mechanical reliability. To solve these problems, a high-speed serial transfer technology was needed for mobile phones that would reduce EMI noise and the number of wires.

*QUALCOMM is a registered trademark of QUALCOMM Incorporated. Mobile Station Modem and MSM are trademarks of QUALCOMM Incorporated. CDMA2000 is a registered trademark of the Telecommunications Industry Association (TIA USA). All other trademarks are the property of their respective owners.