New smaller, thinner WL-CSP (Wafer Level Chip Scale package) contributes to thinner sets. Expanded sensitivity line up.
The greater miniaturization and lower profiles of today’s sets, along with the requisite higher density mounting, result in peripheral components placed near the sensor, whose magnetic field detection capability will be adversely affected by the magnetic fields from various sources, including the hinge section of flip (clamshell) phones, speakers and memory card slots. ROHM sensors not only are compact, but minimize the effects of different magnetic fields for optimized sensitivity.
