ROHM Semiconductor has recently announced the development of the BP5275 series of step-down DC/DC converter modules that integrates all required external components, including input and output capacitors, into a compact, high heat dissipation package. It is the ideal solution for a general-purpose power supply in a variety of electronic devices.
Currently, multiple LDOs, switching regulators, and numerous other electrical components are required in order to provide a stable electrical power to internal circuits. However, the relatively large amount of heat generated by each component requires separate heat sinks or additional substrates to facilitate heat dissipation, making miniaturization difficult. Also, multiple tedious circuit design processes, including selection of external components based on phase compensation, FET voltage, and heat dissipation characteristics are necessary, increasing development time and costs.
In response to this, the BP5275 series was developed, utilizing an in-house high-frequency (1.5MHz) switching regulator IC and synchronous rectification system for high efficiency operation. As a result, mounting area is reduced to 1/6th of the conventional size. The new high-heat-dissipation package enables direct heat dissipation from the element to an aluminium heat sink. An external heat sink can be mounted, increasing output current capability to 800mA. In addition, the 3-terminal, pin-compatible configuration makes it possible to achieve major increases in power supply efficiency without requiring comprehensive modifications.
The line-up includes four types with different output voltages (1.8V to 5.0V), making it possible to select the ideal solution based on the requirements.
