Breaking away from silicon  Full SiC Power Modules  Next-generation semiconductors lead the way to next-generation electric vehicles

Together with Honda R&D Co., Ltd., ROHM has developed a 1200V, 230A-Class (289kVA equivalent) high-power inverter module featuring SiC-SBD and SiC-MOSFET devices for use in next-generation electric vehicles (Photo 1).

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Power semiconductors in automobiles

With the advent of hybrid electric vehicles (HEVs) and electric vehicles (EVs) come an increasing need for power electronics. In this regard there is great anticipation for the practical application of SiC (silicon carbide)*1 technology, which features less loss during power conversion and superior characteristics than conventional Si (silicon) products. Our new module was developed by combining ROHM's SiC device technology with Honda R&D's high power module technology. It represents the world's first high-power module fully driven by SiC devices. Functionally, the inverter module incorporates a converter circuit (1-phase) and an inverter circuit (3-phase) in a single package for greater compactness.

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Photo 1 Full-SiC Power Module

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Overcoming the limits of silicon with SiC

Utilized to reduce total loss, SiC inverters contribute to increased miniaturization of cooling equipment and greater thermal management design flexibility due to significantly less heat generation. As a result, SiC inverters enable a fourfold increase in drive frequency over conventional technology when used in step-up converter applications, promising significant improvements in output volume and density by making peripheral components smaller and more lightweight. In addition, the superior high-temperature stability of SiC facilitates failsafe design in on-board applications. ROHM offers SiC SBDs (Schottky Barrier Diodes*2), with a chip size of 5.14 × 5.14mm, and 4.8 × 2.4mm MOSFETs. SiC devices have been shown to dramatically reduce switching loss, to approximately 1/7th that of Si-IBGT*3 devices (Photo 2).

Switching loss even in power modules has been reduced to approximately 1/4th or less than that of conventional Si devices (Fig. 1).

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Photo 2 SiC-SBD Wafer (left) and SiC-MOSFET Wafer (right)

Fig. 1 Performance Comparison: Conventional Product vs. SiC Power Module Device (125℃)


SiC reduces total loss during power conversion, including ON resistance.
In addition, reducing switching loss enables a proportional increase in PWM drive frequency, from 20kHz seen in conventional Si-IGBT-based modules to 80kHz,- a fourfold increase.

 

Advantages of SiC device power modules
Advantages of SiC device power modules

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Future Outlook

By applying these newly developed SiC high-power modules to HEVs and EVs one can expect significant improvements in efficiency with considerable reductions in both size and weight. As the technology progresses ROHM believes that even greater advancements in performance will be possible through refinements made to the structure of power modules that will enable them to take full advantage of the standalone performance of SiC-MOSFETs, as well as through greater miniaturization. ROHM will continue to expand its lineup of SiC devices to include switching power supplies, industrial equipment and other practical devices for power conversion that are expected to become essential in the field of power electronics (Fig. 2).

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Fig. 2 Device categories and target markets for SiC devices, by output

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Terminology

*1 SiC (Silicon Carbide)
A compound semiconductor with a band gap approximately 3 times greater than silicon, a dielectric breakdown field approximately 10 times larger, and thermal conductivity around 3 times greater. These superior physical properties make SiC ideal for power devices.

*2 SBD (Schottky Barrier Diode)
A diode that is characterized by a metal-semiconductor junction for low voltage drop and fast switching action. Excellent rectifying properties.

*3 IGBT (Insulated Gate Bipolar Transistor)
IGBTs combine the simple Gate-drive characteristics of MOSFETs with the high-current and low–saturation-voltage capability of bipolar transistors by combining an isolated gate FET for the control input, and a bipolar power transistor as a switch, in a single device. However, the minority carriers injected into the n- drift region take time to enter and exit or recombine at turn on and turn off, resulting in relatively longer switching time and higher switching loss.


The Index of This Issue

Latest Number vol. 4 / 2009.01

Cover Story 2
Breaking away from silicon
Full SiC power modules

cover story 2