Ultra-compact WL-CSP EEPROMs | New product new technology

Feature 1 | Feature 2 | Feature 3 | Lineup

Expanded lineup of compact package types

Overview

Wafer-level chip-scale packages contribute to smaller module devices, mobile phones, and other portable electronics.

Ultra-compact package ideal for small modules and portable devices.
Package height: 0.35mm(Max.) / 0.4mm（Max.) / 0.55mm(Max.)
The entire lineup combines ROHM's unique double cell configuration with double reset functionality.

Feature 1 : The industry’s first! WL-CSP optimized for compact modules

ROHM offers the industry's first^* EEPROMs in a Wafer-Level Chip-Scale Package. * November 2009 ROHM study

Feature 2 : Failsafe double cell structure + Double reset function

♦ Double Cell

Data is written to the EEPROM by passing electrons through a tunnel-oxide film. This process places a significant amount of stress on the film, possibly leading to erosion and, subsequently, memory bit failures that can prevent data from being written to the cells.
To avoid this, ROHM utilizes a unique double-cell structure that allocates two cells for each bit of data. Therefore, if one cell malfunctions the other will automatically activate for seamless operation.

♦ Double Reset

Typically, ICs are unstable during ON/OFF. Often, noise is generated, which can lead to microcontroller malfunctions. Opamps and general logic ICs can normally recover from malfunctions. EEPROMs, on the other hand, are highly susceptible to memory failure, even after one malfunction. ROHM EEPROMs resolve this problem by utilizing two protection circuits (power ON reset/undervoltage erroneous WRITE detection) that prevent malfunctions due to power failures and ON/OFF switching.

Feature 3 : Safe, uniform production

Uniform, streamlined production is performed throughout the entire process, from wafer fabrication to assembly, resulting in unsurpassed quality.

Lineup

♦ SPI BUS Type

BUS type	SPI BUS
Density	8Kbit	16Kbit+LDO *	128Kbit
Part Number	BU9832GUL-W	BU9829GUL-W	BR25S128GUZ-W
Package (Reverse)
Size X: Size Y: Height H: Ball Pitch P:	X:2.09mm Y:1.85mm H:0.55mm(Max.) P:0.5mm	X:1.74mm Y:1.65mm H:0.55mm(Max.) P:0.5mm	X:2.00mm Y:2.63mm H:0.4mm(Max.) P:0.5mm

* WL-CSP LDO regulators optimized for wireless LAN modules
Variable output voltage 2.7V-3.0V in 0.1V increments. Current capacity: 10mA (BU9829GUL-W only)

♦ I²C BUS Type

BUS type	I²C BUS
Density	2Kbit	4KBit	8Kbit	16Kbit	32Kbit	32Kbit	64Kbit
Part Number	BU9833GUL-W	BU9847GUL-W	BU9889GUL-W	BU9844GUL-W	BU9890GUL-W	BU99901GUZ-W	BU9880GUL-W
Package (Reverse)
Size X: Size Y: Height H: Ball Pitch P:	X:1.27mm Y:1.50mm H:0.55mm(Max.) P:0.5mm	X:1.06mm Y:1.95mm H:0.55mm(Max.) P:0.5mm	X:1.60mm Y:1.00mm H:0.55mm(Max.) P:0.5mm	X:1.60mm Y:1.84mm H:0.55mm(Max.) P:0.5mm	X:1.05mm Y:1.76mm H:0.55mm(Max.) P:0.5mm	X:1.05mm Y:1.76mm H:0.35mm(Max.) P:0.5mm	X:1.98mm Y:1.59mm H:0.55mm(Max.) P:0.5mm