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Energy Saving!ECO Devices

High brightness high heat dissipation white LEDs in the PSML3 package

Overview | Features | Electro-Optical Characteristics | Applications

Broad lineup ideal for backlighting and lighting applications

Overview

■A new high brightness, high heat dissipation package (PCML3) utilizing flat frame construction has been added to the lineup.
The 5630 (2212in) size is larger than the PSML2 Series while featuring a light guide thickness of only 3mm, making them suitable for backlighting applications as well.

Package
External Dimensions

Features : Original high heat dissipation package

■High heat dissipation package construction
The flat frame structure allows direct heat dissipation through the substrate.

High heat dissipation package construction

■Current vs. Luminous Flux
Features include improved luminous flux in the high current region compared with conventional products. In addition, high heat dissipation characteristics minimize heat generation even at high output.

Current vs. Luminous Flux

Electro-Optical Characteristics

[For Backlighting]
Part No. Forward
Current
IF(mA)
Luminosity
IV(cd)
Luminous
Flux
ΦV(lm)
Luminous
Efficiency
(lm/W)
PSL0205WBWW1 60 4.2

16

87

[For Lighting]
Part No. Color
Temperature
(K)
Color Rendering
Characteristics
(Ra)※
Forward
Current
IF(mA)
Luminosity
IV(cd)
Luminous
Flux
ΦV(lm)
PSL0205WBEBW1 5000 80

60

5 20
PSL0205WBFBW1 3000 4.5 17
*The Ra=60 to 95 color rendering index enables support for color rendering applications of all types
(Ra will vary depending on the brightness).

Applications

Backlighting for LCDs, lighting/illumination devices

Applications

Related Information

ROHM utilizes the most advanced technologies to develop products optimized for current and next-generation devices.
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