Ultra-compact multi-element PIN diode package | New product new technology | LSIs

Flexible pattern layout based on circuit specifications Ultra-compact multi-diode array

Overview

With the miniaturization of portable devices comes the need for increasingly smaller, thinner components. In response to this ROHM has integrated multiple diodes into a single package utilizing advanced device processes and ultra-precise manufacturing technologies. The HMD8 series features 8 pins and 4 elements, while the HMD12 incorporates 6 elements in a 12-pin package. Both the internal configuration, including the diode type, and external pin layout are customizable, making them ideal for compact applications of all types.

Features

Ultra-precise technologies and proprietary device processes utilized to integrate multiple diodes into a single chip. (RN142ZS8A: 4 chips max., RN142ZS12A: 6 chips max.)
47% smaller surface area, 20% thinner than conventional single chip/single package diodes:
Environmentally friendly halogen-free resin used
Flexible pattern layout

Lineup

Part No.	Absolute Maximum Ratings (Ta=25º)		Electrical Characteristics (Ta=25º)				Package
	V_R (V)	I_F^* (mA)	V_F(V)		C_t(pF)
	V_R (V)	I_F^* (mA)	Max.	I_F(mA)	Max.	V_R(V)f=1MHz
RN142ZS8A	30	50	1.0	10	0.45	1	HMD8
RN142ZS12A	30	50	1.0	10	0.45	1	HMD12

* per element