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IC Package Guide

Feature 1| Feature 2| Feature 3| Feature 4| Feature 5| Feature 6|

Get detailed specs - size, mounting specs, packaging

Overview

Previously, package information on ROHM's website can only be found on individual product pages, with separate links for different package characteristics, making it difficult to easily obtain detailed information.
ROHM now offers a page dedicated specifically for IC packages, containing all of the relevant characteristics for every IC package currently available. All of this information is displayed in a convenient table that enables quick comparison, simplifying selection.

 Click here for the IC Package page
Example: Lead-free packages
Rotate and magnify packages View packages from 3 angles: front, vertical and horizontal View the package specs Discover the marking codes Obtain the necessary land patterns Access soldering conditions

Feature 1 : Freely rotate and magnify any package

Smaller packages make it difficult to view the pin configuration and discern heat dissipation fins and other important features. ROHM now enables detailed viewing of all IC package types. Freely magnify and rotate in 3 dimensions.

 Freely rotate and magnify any package

Feature 2 : View packages from 3 angles: front, vertical and horizontal

Determine the tolerances in every dimension

 View packages from 3 angles: front, vertical and horizontal

Feature 3 : View the package specs

Embossed tape, tube containers, trays, and other packaging types. In the case of embossed tape, the reel size, feed direction, part count, and other details are displayed.

 View the package specs

Feature 4 : Discover the marking codes

Discover the unique marking code of each product, which provides additional details concerning production.
Discover the marking codes

Feature 5 : Obtain the necessary land patterns

Land patterns necessary for board design are provided. Determine the mounting area required at a glance.
Obtain the necessary land patterns

Feature 6 : Access soldering conditions

Preheating temperature, soldering temperature, and other recommended conditions during reflow are provided.
Access soldering conditions

Related Information

[Design Support]

ROHM utilizes the most advanced technologies to develop ICs that meet market needs.

Click here for inquiries concerning our products

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